江苏芯德
江苏芯德半导体科技有限公司成立于2020年9月,是一家致力于中高端封装测试的集成电路企业。可为客户提供Bumping、WLCSP、Flip Chip PKG、QFN、BGA、SIP、SIP-LGA、2.5D的封装产品设计和服务。2023年3月推出CAPiC平台,重点发展以Chiplet异质集成为核心的封装技术。
To improve manufacturing processes and promote lean production, the entire factory deployed RockPlus MES. Through RockPlus MES secondary development interface CBMPI, remote data collection and control of 22 production lines was successfully implemented, reducing an average of 2 personnel per line.
Line-side warehouses adopted intelligent electronic material racks, reducing manpower by at least one-third.
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