RockPlus EFEM

Semiconductor Equipment Front-End and Tool Control Software

From wafer handling to process execution, integrated control for semiconductor equipment. For semiconductor equipment makers and equipment automation integrators, RockPlus EFEM is host control software covering wafer loading, robot control, transfer scheduling, process flow, recipe management, equipment monitoring and SECS/GEM communication.

Through a reusable software control framework, it integrates units such as load ports, robots, aligners, motion controllers, process chambers and equipment I/O, coordinating equipment motion and production flow, and exchanging data with factory systems such as MES, EAP and Host.

Wafer Handling Robot Control Equipment Automation Recipe HMI SECS/GEM
EFEM CONTROL CONSOLE

Equipment Unit Status

LoadPort
Ready
Robot
Run
Aligner
Ready
Chamber
Proc
MappingSlot 25 · Mapped
RecipeLoaded · Validated
HostRemote · HSMS
Alarm0 Alarm · 0 Warn

Wafer Transfer · Wafer #07

LoadPortRobot PickAlignerProcess Pos.Return
Unified Scheduling
Pick → Align → Place
Host Integration
SVID · CEID · Remote Command
8 Core CapabilitiesFrom handling and control to recipe and communication
Four-Layer ArchitectureInterface, execution, control, factory collaboration
Modular & ReusableEquipment differences stay in the interface layer
SECS/GEM IntegrationConnects to EAP, MES and Host
Business Challenges

Semiconductor equipment control is
more than making hardware move

Semiconductor equipment often contains multiple controllers, actuators and process units. The real challenge is getting different hardware to work together under one logic, while meeting production automation, exception handling and factory system integration requirements.

01

Complex interfaces, high integration cost

Robots, load ports, motion controllers and I/O modules from different vendors use different communication protocols and control methods, each requiring separate handling of command exchange, status feedback and exception logic.

02

Multiple units, complex control logic

Wafer transfer involves pick and place, path planning, state decisions, equipment handshakes and process-position coordination. Multiple execution units need strict action sequencing and safety interlocks.

03

Many process variants, hard to reuse

Equipment differs in mechanical structure, process flow, recipe parameters and control cycle. Without a modular design, software easily turns into duplicated development and a long-term maintenance burden.

04

High automation demands, hard to trace exceptions

Equipment must not only run processes stably, but also support Host remote control, status reporting, alarm handling, production data logging and interface bring-up.

Control Architecture

A Unified Software Control Framework Connecting Equipment Hardware and Factory Systems

The framework is built around the core control logic equipment needs to run, spanning device interfaces, action execution, flow scheduling and upper-layer communication. Its modular design separates generic control functions from each machine's mechanical structure, control protocol and process logic, giving different types of semiconductor equipment an extensible software foundation.

EFEM CONTROL FRAMEWORK

Equipment differences stay in the interface layer; generic control capability is captured in the software framework

Four layers with clear roles, easy to tailor and reuse from project to project.

Factory System Layer
MES · EAP · Host
Host Control Layer
HMI · Recipe · Alarm · Data · User
Scheduling & Execution Layer
Scheduling · Robot · Sequence · Interlock
Hardware Interface Layer
LoadPort · Robot · Aligner · Motion · I/O · Chamber
RockPlus EFEM · Equipment Control Software Core
SECS/GEM · HSMS
Status, events, alarms, recipes, remote commands
Operation & Permissions
Parameter configuration, status monitoring, run records
Wafer Flow & Sequencing
Robot motion, handshakes, exception recovery
Serial · Motion Bus · I/O
Vendor-specific protocol integration
LoadPortRobotAlignerServo / MotionDigital I/OProcess Chamber
Core Capabilities

Core Capabilities

The core software capabilities a semiconductor equipment host system needs, built around wafer transport, equipment motion, process execution and factory automation integration.

01 / WAFER HANDLING

Wafer Loading & Position Management

Builds loading and position management logic around load ports, FOUP/Cassette and wafers, with RFID identification, slot mapping, carrier status and wafer position data integrated as the equipment requires.

LoadPort · FOUP/Cassette · RFID · Slot Mapping
02 / WAFER SCHEDULING

Wafer Transfer & Path Scheduling

Manages wafer flow between the load side, robot, aligner and process positions, coordinating pick, place, transfer sequence and execution status.

Wafer Transfer · Path Scheduling · Robot Coordination
03 / MOTION & ROBOT

Robot & Motion Control Integration

Connects robots, servo axes and equipment motion control units, encapsulating initialization, homing, manual operation, motion execution, status feedback and exception recovery.

Robot · Servo · Home · Reset · I/O
04 / PROCESS CONTROL

Process Flow & Equipment Coordination

Coordinates the sequencing of transfer motions, process units, sensor signals and actuators, with state machines, handshake logic and software interlocks configured to the equipment.

Process Sequence · Equipment Handshake · Interlock
05 / RECIPE

Recipe & Production Job Management

Provides recipe selection, editing, loading, parameter validation and execution control, and can link recipes to process units and drive the execution flow by lot or production job.

Recipe · Parameter Validation · Lot / Job
06 / HMI & OPERATION

Visual HMI & Equipment Operation

A host interface that shows equipment status, mechanism positions, process progress and alarms, with manual debugging, parameter configuration and tiered user permissions.

HMI · Manual Control · User Permission · Configuration
07 / ALARM & TRACE

Exception Handling & Run Data Traceability

Equipment alarm detection, exception handling, history and run log management, with timeout protection, recovery strategy, process records and data export configured per project.

Alarm / Warn · Recovery · History Log · Data Export
08 / FACTORY AUTOMATION

SECS/GEM & Factory Automation Integration

Connects to upper-layer EAP, MES or Host over SECS-II, GEM and HSMS, exchanging status variables, equipment events, alarms, reports and remote control commands.

SECS/GEM · HSMS · SVID · CEID · RPTID · Remote Command
Automation Workflow

From Wafer Loading to Process Completion, Equipment Flow Runs in Order

Coordinating material identification, mechanical motion, process execution and production information exchange around a typical semiconductor equipment job flow.

Exception Handling

Exception handling
runs through the whole control flow

Alarms, stops, resets or manual intervention follow preset strategies, with the run records kept.

When equipment reports an exception, the system follows the preset strategy to raise an alarm, stop, reset or hand over to an operator, and keeps the related run records as the basis for equipment diagnosis and problem tracing.

01
Carrier LoadingFOUP/Cassette enters the load port; presence detection, carrier identification and load status confirmation are completed
02
Wafer Identification & MappingSlot mapping data is read or maintained to establish the correspondence between wafers and load positions
03
Equipment InitializationRobots, actuators and related control units are initialized, homed and confirmed ready
04
Wafer TransferPick, alignment (as required) and place actions run according to the transfer path and equipment status
05
Process CoordinationThe wafer is delivered to the specified process position, coordinating equipment handshakes, recipe and related process actions
06
Wafer Out & Job EndWafers are picked up, returned and positions updated, and the production job is closed out
07
Data Logging & Status ReportingKey actions, equipment status, alarms and production events are recorded and exchanged with the Host per the interface specification
Product Value

From One-off Development to Continuous Reuse

A modular control framework serves the stable operation of the current equipment and lays a foundation for adapting the next ones faster.

01 / MODULAR

Modular control for different equipment architectures

Device interfaces, motion control, scheduling flow and upper-layer communication are organized as modules, so adaptation can be done at project level for different mechanical structures and process requirements.

02 / SCHEDULING

Unified scheduling across multiple actuators

Load ports, robots, process units and motion mechanisms are coordinated under one control logic, reducing the state and flow complexity that comes from distributed control.

03 / HW + SW

Software and hardware in step for automated operation

Connecting on-site hardware execution with host business logic enables flow control from manual debugging and automatic operation through to exception handling.

04 / TRACEABILITY

Data records for maintenance and factory integration

Equipment actions, operating status and exception information are recorded and connected to upper-layer systems through standard communication interfaces, providing the data basis for equipment diagnostics and production traceability.

Application Cases

Typical Application Cases

RockPlus EFEM's control software capabilities can be adapted to the mechanical structure, motion logic and process requirements of different semiconductor equipment.

CASE 01

SJSemi | EFEM Control System for a Wafer Transfer Tool on an Advanced Packaging Line

Application: automated wafer loading and unloading with equipment coordination for advanced packaging equipment

For the wafer send and receive application on SJSemi's advanced packaging line, the project built wafer auto-transfer and tool-level flow control software around the collaboration between load ports, a dual-arm robot, an aligner, RFID and process equipment.

Following the equipment's process requirements, the system provides unified control of carrier identification, wafer position management, pick and place motions, pre-alignment, process-position handover, lot management and Host communication.

Key Technical Implementation

01 / LoadPort & Carrier Identification

Integrates RS232 SMIF load ports and OMRON RFID readers, managing FOUP/Cassette presence status, TagID, the binding between Port1/Port2 and slot mapping data.

02 / Dual-arm Robot & Alignment Control

Integrates a DAIHEN dual-arm SCARA robot and an RS232 aligner, encapsulating Home, ServoON, ResetAndORG, pick and place and alignment motions, and supporting transfer coordination among robot, cassette, aligner and CV/Stage.

03 / Automatic Flow & Lot Management

Implements the Auto Run load and unload cycle, CycleStop, exception recovery, recipe loading, Lot_End handling and Local/Remote mode switching.

04 / Host Communication & Event Reporting

Connects to the Host over SECS/GEM and HSMS with SVID status variables, CEID events, RPTID reports, S2F41 remote commands and equipment run log management.

Application Extension

The related EFEM control framework covers front-end load and unload control projects for Oven/RTP, Mounter, Printer, Dispenser and other equipment types, adapted to their wafer in/out and process interfaces.

Case Value

Bringing wafer transfer, alignment, process handover and Host communication into one software control flow provides a reusable development foundation for EFEM control across multiple types of advanced packaging equipment.

DAIHENSMIF LoadPortOMRON RFIDAlignerSlot MappingSECS/GEM
CASE 02

Cleaning Tool | Tool-level Host and Process Control Software Solution

Application: transfer scheduling and process coordination for multi-chamber wafer cleaning equipment

For the automation requirements of multi-chamber cleaning equipment, wafer front-end transfer, robot motion, multi-chamber process execution, chemical supply lines and host monitoring are all part of one overall software control solution.

The scope covers EFEM wafer scheduling, EtherCAT motion control, JEL robot integration, process sequencing, recipe, safety interlocks, data logging and factory automation interfaces.

Key Technical Scope

01 / EFEM Wafer Scheduling

For 2 load ports, wafer path planning, arm assignment, sequential and parallel process scheduling and unit masking logic coordinate front-end transfer with the process units.

02 / Robot & Motion Control

Integrates JEL robot communication, initialization, manual pick and place, and status and alarm diagnostics; connects Mitsubishi servo axes through an EtherCAT master card, managing I/O mapping, homing, motion status and fault handling.

03 / Multi-chamber Process Sequencing

Around multiple process chambers and multiple arms, spindle, chuck and nozzle motions are managed, with recipe steps, recipe-to-chamber binding, arm anti-collision and software interlocks defining the process control logic.

04 / Chemical Supply & Line Control

Dual-tank priority supply, level-based tank switching, valve control, line status monitoring and abnormal shutdown handling, with the related status and operation screens provided in the HMI.

05 / HMI, Alarms & Data Management

Tool-level dynamic status, process chamber and robot monitoring, supply line pages, manual debugging, Alarm/Warn classification, alarm guidance and trend curves, plus robot, wafer and FA logs with data export.

06 / SECS/GEM & FA Interfaces

Per the Host specification, SEMI E5/E30/E37 and the project-applicable functions of E40/E116/E84/E87/E94/E39 plus RFID interfaces are planned, with software verification through module bring-up, simulation, exception scenario testing and FAT.

Solution value: demonstrates EFEM control software design capability extending from front-end wafer transfer to multi-chamber process sequencing, motion control, chemical supply systems and factory automation integration.
JEL RobotEtherCATMitsubishi ServoMulti-ChamberARMChuckRecipeSECS/GEM

Note: this case is compiled from the technical scope in the host control system quotation for a cleaning tool. The functions actually delivered and their implementation status are subject to the final confirmed project version.

Technology & Integration

Adapted to Different Equipment Interfaces and Factory Automation Requirements

Interfaces, standards scope and implementation approach are determined by the actual equipment configuration and the Host specification.

DEVICE CONTROL

Equipment Control & Hardware Interfaces

Robot communication, RS232 serial devices, EtherCAT motion control, digital I/O and other vendor-specific control interfaces are integrated according to the actual equipment configuration.

SECS / GEM

Semiconductor Equipment Communication

Supports equipment-to-Host communication integration around SECS-II (SEMI E5), GEM (SEMI E30) and HSMS (SEMI E37), handling status, events, alarms, reports and remote commands.

SEMI STANDARDS

Extended Automation Standards

For equipment that needs carrier handover, carrier management, processing management or control job management, the applicable scope and development content of the relevant SEMI standards can be assessed against the project Host specification.

DELIVERY

Equipment Software Integration & Delivery

Projects run through control object and interface analysis, software module development, unit debugging, tool-level integration, exception scenario testing and FAT support, delivering software and technical documentation as agreed.

FAQ

Common questions on the positioning of EFEM control software, equipment adaptation, its difference from GEMLink and SEMI standard support.

Is RockPlus EFEM a hardware product or control software?

RockPlus EFEM is semiconductor equipment front-end and tool-level host control software. It coordinates the motion and production flow of hardware such as load ports, robots, motion control and process units. The specific hardware is determined by the actual configuration of the equipment project.

Can it adapt to robots and equipment controllers from different vendors?

Adaptation is carried out per project based on the communication protocols, SDKs, I/O and motion control interfaces a robot or controller exposes. Existing technical work covers robots such as DAIHEN and JEL and various on-site control solutions; the exact supported scope needs to be assessed against the equipment interfaces.

What is the difference between RockPlus EFEM and RockPlus GEMLink?

RockPlus EFEM focuses on wafer transfer, mechanical motion, process flow, HMI and tool-level control inside the equipment, while RockPlus GEMLink focuses on standardized communication and data exchange between equipment and EAP, MES or Host. The two can work together in equipment automation scenarios, or implement their respective functions independently according to project requirements.

Does it support SECS/GEM and other SEMI standards?

The software can build equipment communication capabilities around SECS-II, GEM and HSMS. The applicable functions, implementation scope and compliance requirements of other SEMI standards need to be confirmed according to the equipment type, the Host specification and project verification results.

Can it be customized for a specific equipment process?

Software adaptation development can be carried out for the equipment structure, robot type, process flow, recipe, controller interfaces and safety logic, with the actual equipment functions verified through integration and testing.

Build more flexible control software for complex semiconductor equipment

Whether developing host software for new equipment or upgrading control software on existing tools, RockPlus EFEM provides control software solution design, equipment integration and automation interface development around the actual hardware configuration and process requirements. From mechanical motion to production flow, from local equipment control to factory system collaboration, equipment software becomes an extensible control foundation.

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